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    New wire bonded microtransformers published

    04.11.2013 20:05
    Researchers of the microactuators laboratory have published a paper on novel 3D solenoidal on-chip wire bonded microtransformers in JMM.

    The new paper “Wire bonded 3D coils render air core microtransformers competitive” has been published by Ali Moazenzadeh et al. in the Journal of Micromechanics and Microengineering. There, the researchers report on a novel wafer level fabrication method for 3D solenoidal microtransformers for very high frequency applications using an automatic wire bonder. The highlights include:

    • Both gold and copper wire bonded microtransformers; fabrication and characterization
    • Simulation results of the frequency-dependent impedance matrix parameters.
    • Analysis of the effect of PDMS packaging on the electrical properties of the transformers.
    • Investigation of the batch fabrication potential of the technology.
    • Benchmarking the state of the art VHF microtransformers.

    The paper is open access and free to download.



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