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    Drahtbonder wickeln Mikrotransformatoren

    04.11.2013 19:39
    Wissenschaftler des Mikroaktorik Lehrstuhls veröffentlichen mit einem automatischen Drahtbonder auf Chip-Ebene hergestellte solenoide 3D Mikrotransformen.

    The new paper “Wire bonded 3D coils render air core microtransformers competitive” has been published by Ali Moazenzadeh et al. in the Journal of Micromechanics and Microengineering. There, the researchers report on a novel wafer level fabrication method for 3D solenoidal microtransformers for very high frequency regime applications using an automatic wire bonder. The highlights include:

    • Gold wire bonded microtransformer fabrication/characterization results.
    • Copper wire bonded microtransformers fabrication/characterization results.
    • Simulation results of the frequency-dependent impedance matrix parameters.
    • Analysis of PDMS packaging effect on the electrical properties of the transformers.
    • Investigate the batch fabrication potential of the technology.
    • Benchmarking the state of the art VHF microtransformers.

    The paper is open access and free to download.



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